Characterizing flexible electronics in 3D
Flexible electronics open up a realm of new applications in the fields of wearables, thin film solar cells, RFIDs and displays used in automotive dashboards or medical applications. For all these use cases, the product reliability is a key quality indicator. Also there is an increasing demand in components to be harmonized for signal processing, communication and energy generation. For such applications, white-light interferometry allows scanning the entire surface of hybrid flexible electronics in a single shot. The optical and non-destructive measurement method characterizes printed electronics on behalf of form parameters, roughness and structural details and help secure the electronics quality and functionality.
Form parameters & surface roughness of printed electronics
Scanning surfaces and evaluating 3D height information enables a fast and reliable characterization of printed and flexible electronics. 3D surface metrology solutions from Polytec provide meaningful data for both electronics quality and printed electronics process stability. The advanced color information mode helps determining and localizing defects.
For in-line integration and for semi- or fully automated manufacturing processes of flexible electronics, TopMap sensor heads can easily be integrated into production lines, offering customized solutions for in-line inspection. Upon demand, users can manage and load predefined measurement settings, enabling one-click inspections at production level using measurement recipes. Our PolyXperts are happy to assist at all project stages, such as developing custom routines and evaluations, using the open software architecture.
For more information about how to master electrically conductive bonding of flexible electronics, visit the Polytec PT section for polymer technology solutions.
Free sample report? Measurement service or rental?
Characterziation of micro electronics
Related products
TopMap Micro.View
TopMap Micro.View® is an easy to use and compact optical profiler. Choose Micro.View® as the cost-effective quality control solution for surface analysis of precision-engineering, for inspecting roughness, microstructures and more surface details.
TopMap Micro.View+
TopMap Micro.View®+ is the next generation optical surface profiler in a modular design to reliably measure the most challenging analysis tasks regarding surface finish and microstructures with utmost precision. Focus Finder and Focus Tracker assist in keeping samples focused at all times, with fully motorized positioning units ready for automation. Find out more!
TopMap Pro.Surf+
The all-in-one 3D optical metrology solution from Polytec. This ultra precise white-light interferometer combines a chromatic confocal sensor for roughness profiles with an areal measurement of geometrical paramters and form deviation in a multi-sensor system. Pro.Surf+ is the choice to measure both the topography of large sampels with a large field of view (FOV) while also characterizing structural details with nanometer resolution.
Further applications
- Die bonding
![Elektrisch leitendes Kleben in der Elektronik]()
- Flexible electronics
![Flexible Elektronik gekonnt elektrisch leitend kleben]()
- Ball grid array (BGA)
![bump measurement on a ball grid array (BGA) as 3D profile]( "bump measurement on a ball grid array (BGA) as 3D profile")
bump measurement on a ball grid array (BGA) as 3D profile - High power laser diodes
![Inspection of flatness and step-height on high power LED]( "Inspection of flatness and step-height on high power LED")
Inspection of flatness and step-height on high power LED - Mobile devices
![Production testing of components for mobile devices using 3D optical surface metrology]( "Production testing of components for mobile devices using 3D optical surface metrology")
Production testing of components for mobile devices using 3D optical surface metrology - Pass/fail analysis
![Multi-sample pass-fail analysis in manufacturing]( "Multi-sample pass-fail analysis in manufacturing")
Multi-sample pass-fail analysis in manufacturing - Surface roughness
![Surface roughness masurement and measuring Ra, Rz roughness parameters]( "Surface roughness masurement and measuring Ra, Rz roughness parameters")
Surface roughness masurement and measuring Ra, Rz roughness parameters - Layer thickness
![Optical and areal step edge test showing a 75.2 nm thick coating]( "Optical and areal step edge test showing a 75.2 nm thick coating")
Optical and areal step edge test showing a 75.2 nm thick coating - Surface parameters
![Surface parameter characterizing the form, waviness and texture of a workpiece]( "Surface parameter characterizing the form, waviness and texture of a workpiece")
Surface parameter characterizing the form, waviness and texture of a workpiece
