Conducting extensive and precise micromechanics analyses
The possibility to directly integrate microscopic, mechanical functional units with semiconductor electronics at silicon level gave rise to a multitude of different micromechanical sensors and actuators and to the huge success of MEMS and microstructures. The sheer range of product types and areas of use is huge.
The variety of device type encompasses pressure and inertial sensor systems for automotive and aerospace applications, MEMS microphones, MEMS acceleration and gyroscope sensors for portable electronic devices, a wide range of micro mirror elements for light manipulation, energy harvesters for autonomous systems and microbalances for extremely small material quantities. And, lastly, there are pMUTs and cMUTs for generating ultrasonics in medical technology and micro-acoustic elements such as SAWs, which are increasingly being put to use as electronic filter elements, but are also deployed in lab-on-a-chip applications too.
Capturing both in-plane and out-of plane motions
Reliable and precise measurement of not only the electrical measuring technology, but also the direct mechanical function – in other words, the movement of the smallest silicon components – is absolutely essential to developing MEMS components such as this. Using the microscope based single-point or scanning vibrometers from Polytec, you can measure displacements in the pm range, and acquire transfer functions and operational deflection shapes in either 1D or 3D, with a high frequency bandwidth and lateral resolution in the µm or sub-µm range. You also have the option of capturing your microsystem’s topography with the MSA Micro System Analyzer. The MSA-100-3D Micro System Analyzer allows for a real 3D vibration measurement with pm path resolution for both out-of-plane (OOP) and in-plane (IP) components. Here, this is taking place on an MEMS cantilever.
Microstructure characterization
相关产品
MSA-100-3D显微式激光测振仪
3D显微式激光测振仪同时记录XYZ三个方向的振动分量，测试带宽覆盖DC~25 MHz，每向的振幅分辨率均达到亚皮米级，可用于面内和面外振动测试。
MSA-600显微式激光测振仪
MSA-600显微式激光测振仪专用于测量MEMS和显微结构，是获取三维静态特性与动态特性的一体化光学测量解决方案，其有助于加快产品开发进程，优化产品质量控制，甚至可集成至商用探针台上进行晶圆级测试。现在高达 8 GHz。
更多应用
- 晶片级
![Deflection shape after modal testing microacoustic device on wafer level]( "Deflection shape after modal testing microacoustic device on wafer level")
Deflection shape after modal testing microacoustic device on wafer level - MEMS样机试验
![MEMS prototype testing, here a CMOS / MEMS co-integrated flow microsensor, (C) University of Louvain, Belgium]( "MEMS prototype testing, here a CMOS / MEMS co-integrated flow microsensor, (C) University of Louvain, Belgium")
MEMS prototype testing, here a CMOS / MEMS co-integrated flow microsensor, (C) University of Louvain, Belgium - cMUTs and pMUTs
![Laser Doppler vibrometer measurements of several leaking CMUT cells visualizing dynamic displacement]( "Laser Doppler vibrometer measurement of leaking CMUT transducer cells")
Laser Doppler vibrometer measurements of several leaking CMUT cells, visible with a much lower dynamic displacement when operating the device - SAWs and BAWs
![Dynamic measurement of a SAW surface acoustic wave filter]( "Dynamic measurement of a SAW surface acoustic wave filter")
Dynamic measurement of a SAW surface acoustic wave filter - 可靠性
![Vibration measurements for reliability testing on MEMS in a vacuum chamber]( "Vibration measurements for reliability testing on MEMS in a vacuum chamber")
Vibration measurements for reliability testing on MEMS in a vacuum chamber - 生物 MEMS
![Deflection shape of cMUT transducer array, University of Alberta]( "Deflection shape of cMUT transducer array, University of Alberta")
Deflection shape of cMUT transducer array, University of Alberta
